Heat sink

ABSTRACT

A heat sink has a fin set and at least one heat pipe. The fin set has multiple stacked fins and at least one tapered tube. Each fin has at least one protrusion. The at least one protrusion protrudes from each fin and each protrusion has an internal surface. The at least one tapered tube is defined through corresponding protrusions of the fins. The at least one heat pipe has at least one tapered arm and a pipe wall. The tapered arm corresponds to and is mounted through a corresponding tapered tube of the fin set. The pipe wall of the heat pipe abuts the internal surfaces of corresponding protrusions of the fins tightly so heat can be dissipated efficiently during use.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat sink, and more particularly to aheat sink that has at least one tapered heat pipe mounted through andcontacting fins tightly to improve thermal conductivity.

2. Description of the Prior Arts

A heat sink is connected to a central processing unit (CPU) to dissipateheat from the CPU so preventing the CPU from overheating and maintainingworking efficiency.

A conventional heat sink is a metal device with multiple fins and atleast one heat pipe. The fins are stacked and each fin has a surfacearea, multiple through holes and multiple protrusions. The through holesare defined through the fins and correspond to and align with thethrough holes of adjacent fins. The protrusions are formed around thethrough holes and have inner surfaces. The at least one heat pipe abutsan electronic device and is mounted through corresponding through holesand has a pipe wall. Solder is filled between the pipe wall of the atleast one heat pipe and the internal surfaces of the protrusions to weldthe heat pipe and the protrusions. The heat pipe absorbs heat from theelectronic device and transmits the heat to the fins that radiate theheat to the air rapidly due to the surface area of the fins.

However, to ensure the heat pipe can be mounted through the fins, thethrough holes must be bigger than the heat pipe, in other words, thereis a gap between the heat pipe and the fins. If the gap is too small,the heat pipe will be mounted through the fins not easily. If the gap istoo big, the more solder must be used and thick solder will reducethermal efficiency. Accordingly, the heat absorbed by the heat pipe isnot dissipated efficiently.

To overcome the shortcomings, the present invention provides a heat sinkto mitigate or obviate the aforementioned problems.

SUMMARY OF THE INVENTION

The main object of the present invention is to provide a heat sink withbetter heat conducting efficiency.

A heat sink comprises a fin set and at least one heat pipe. The fin sethas multiple fins and multiple tapered tubes. The fins are stacked andeach fin has at least one protrusion. The at least one protrusionprotrudes from each fin and each protrusion has an internal surface.Each tapered tube is defined through corresponding protrusions of thefins. The at least one heat pipe has at least one tapered armcorresponding to and mounted through a corresponding tapered tube of thefin set and has a pipe wall. The pipe wall of the heat pipe abuts theinternal surfaces of corresponding protrusions of the fins tightly.Therefore, the heat absorbed by the heat pipe can be dissipatedefficiently during use.

Other objectives, advantages and novel features of the invention willbecome more apparent from the following detailed description when takenin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a heat sink in accordance with thepresent invention;

FIG. 2 is an exploded perspective view of the heat sink in FIG. 1;

FIG. 3 is a partially enlarged side view in cross section of fins of theheat sink in FIG. 1 showing a heat pipe in phantom lines; and

FIG. 4 is a front view of a heat pipe of the heat sink in FIG. 1.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

With reference to FIGS. 1 and 2, a heat sink in accordance with thepresent invention comprises a fin set, at least one heat pipe (20) and ametal seat (30).

With further reference to FIG. 3, the fin set has multiple fins (10) andat least one tapered tube (11). The fins (10) are stacked in sequenceand each fin (10) has at least one protrusion (12). The at least oneprotrusion (12) protrudes from each fin (10), has an internal surfaceand a tapered hole (13). The tapered hole (13) is defined through theprotrusion (12) of each fin (10) and corresponds to and aligns with thetapered hole (13) of subsequent adjacent fins (10). Each tapered tube(11) is formed through the fin set and is defined in correspondingtapered holes (13) of the fins (10), each tapered tube (11) has a bottomhole edge and a top hole edge.

With further reference to FIG. 4, the at least one heat pipe (20) has atleast one tapered arm corresponding to and mounted through acorresponding tapered tube (13) of the fin set and has a pipe wall. Thepipe wall of the heat pipe (20) abuts corresponding internal surfaces ofthe protrusions (12) tightly. Solder may be filled between the pipe wallof the at least one heat pipe (20) and the internal surfaces of theprotrusions (12) to weld the heat pipe (20) and the protrusions (12)more securely. In a preferred embodiment, the at least one heat pipe(20) is U-shaped and has a central arm (21) and two tapered arms (22).The central arm (21) has two ends. The tapered arms (22) arerespectively formed on the ends of the central arm (21) and each taperedarm (22) is tapered and is mounted through corresponding tapered tubes(11) of the fin set.

The metal seat (30) is mounted around the heat pipe (20) and abuts anelectronic device, such as, a CPU. Heat generated by the CPU can betransmitted to the heat pipe (20) via the metal seat (30). In apreferred embodiment, the metal seat (30) is mounted around the centralarm (21) of the heat pipe (20).

Since the tapered tubes (11) of the fin set are tapered and correspondto the heat pipe (20), which also is tapered, the heat pipe (20) ismounted through the tapered tubes (11) of the fin set smoothly and thepipe wall of the heat pipe (20) abuts the internal surface of theprotrusions (12) of the fins (10) tightly. Therefore, heat absorbed bythe heat pipe (20) can be transmitted to the fins (10) to be dissipatedefficiently and thermal conductivity of the heat sink as described isimproved.

Even though numerous characteristics and advantages of the presentinvention have been set forth in the foregoing description, togetherwith details of the structure and features of the invention, thedisclosure is illustrative only. Changes may be made in the details,especially in matters of shape, size, and arrangement of parts withinthe principles of the invention to the full extent indicated by thebroad general meaning of the terms in which the appended claims areexpressed.

1. A heat sink comprising: a fin set comprising multiple sequentiallystacked fins, each fin having at least one protrusion protruding fromthe fin and defining a tapered hole corresponding to and aligning withthe tapered hole of subsequent adjacent fins to define a tapered tubethrough the fin set and having an internal surface; and at least oneheat pipe having at least one tapered arm corresponding to and mountedthrough a corresponding tapered tube of the fin set and having a pipewall abutting corresponding internal surfaces of the protrusions of thefins.
 2. The heat sink as claimed in claim 1, wherein the at least oneheat pipe is U-shaped and has a central arm having two ends; and twotapered arms respectively formed on the ends of the central arm and eachtapered arm formed tapered and mounted through corresponding taperedtube of the fin set.
 3. The heat sink as claimed in claim 1 furtherhaving solder filled between the pipe wall of the at least one heat pipeand the internal surfaces of the protrusions.
 4. The heat sink asclaimed in claim 2 further having solder filled between the pipe wall ofthe at least one heat pipe and the internal surfaces of the protrusions.5. The heat sink as claimed in claim 1 further having a metal seatmounted around the heat pipe.
 6. The heat sink as claimed in claim 2further having a metal seat mounted around the central arm of the heatpipe.
 7. The heat sink as claimed in claim 3 further having a metal seatmounted around the heat pipe.
 8. The heat sink as claimed in claim 4further having a metal seat mounted around the central arm of the heatpipe.